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Thin-film Patterning Processing


1.Patterning processing corresponding to any thin film

In partnership with multiple film-formation manufacturers, we are capable of patterning processing various thin films.

Patterning processing corresponding to any thin film

Please consult with us each specification of the multilayer film.

2.Available for small lot / quick delivery

We are available for customer's desired quantity / delivery time.

3.Example of applications

4.Processing technology

2.Multilayer-film patterning and Achievement

Multilayer-film patterning

we accept between a single prototype and a large order

3.Glass etching

  • Sealing cap
  • Rrooved pattern
  • Hole forming


  • Putting film to glass substrate
  • Adhering glass substrates together
  • Cell production etc.

5.Cutting and slight chamfering

  • Scribing
  • Dicing

6.Screen printing

  • Resist
  • Ag electrode
  • Insulating film, etc.

9.Glass cutting

  • plain glass
  • with thin film ( multilayer film ) attached

10.Patterning by means of lift off

12.ITO Heater

  • Visible heaters like ITO are recommended

5.Assisting various materials evaluation

  • I would like you only to apply our own resist.
  • Is there any place you can ask for exposure and development only?
  • I would like to peel film from substrate!
  • I want to work in a clean room.
  • I want to get a small glass as cheap as possible !

various materials evaluation

Techno print ,also responds to such troubles!
  • In addition to full course from normal cleaning / resist coating to packaging,Cleaning / resist coating only, exposure / development only, etching ~ cut chamfering etc.
    We also accept processing limited to.
    * Perform resist coating, exposure and development under a clean room.
  • In order to evaluate the development of base materials such as PET and PEN, we will assist you with conditions such as resist and polyimide coating.
  • Also we will create an evaluation report according to your request.
  • In addition to helping with evaluation of small lot, please consult mass production correspondence.
USWasherSpatter film forming mashine
Spin coaterBar coater
Clean ovenAlighnment exposure
ITO etchin+resist peelingMetal etching
ScriberProfilometerMeasuring Length

Click here for the main equipment

6.Substrate for equipment evaluation

  • Creating a performance evaluation board for optical equipment that requires pattern recognition
    *For performance evaluation boards when considering the purchase of expensive equipment such as exposure machines
  • Creation of a glass substrate for evaluation of organic EL encapsulation equipment.
  • Prototype supply of equipment evaluation boards even in small lots and in a wide variety of products

Substrate for equipment evaluation

7.Target substrate / processing size

Target substrate

Target substrate

Maximum processing size

Maximum processing size

Key Track Records

Key patterning commissioned for mass production

ITO pattern for STN-LCD 50,000 panels per month
BM pattern for CF 50,000 panels per month
ITO double-printed pattern for capacitance 10,000 panels per month

Patterning commissioned for development or prototyping

For LCD 3D pattern
Pattern for electronic paper
Pattern for evaluation of liquid crystal material
For organic EL Pattern for lighting or display
Glass cap for sealing
Pattern for evaluation of organic EL material
For various TEGs Pattern for evaluation of ACF,IC,FPC, or LCD
For various MEMS Pattern for evaluation of sensors
For various Heaters Pattern for evaluation of ITO for heaters
Pattern for solar cell The organic thin film solar cell electrode pattern
Thin film coating substrate film Organic EL・Organic solar cell・Electrochromic pattern
Optical test chart The distortion of lens, optical characteristic evaluation
Biotechnology Micro channel・cell culture pattern
For Encorder Rotary・Liner Encorder
Evaluation support for development of various materials New resist · Pattern condition of film such as PET, PEN etc. Evaluation support
Microstructure formation Follow ability evaluation of adhesive, adhesive film, filler (semiconductor PKG etc.)
Micro folder such as micro LED
Cover glass spacer of solar cell etc.

Please make use of our equipment according to your request.

In particular, the photolithography process works in a clean room (Class1000) environment.

* Furthermore, the coating process (roll coater), exposure equipment, etc. are further improved in cleanliness at the local booth (Class100).

ProcessequipmentCorresponding board size (mm)Specifications / Remarks
Washingwashing machineBatch type washerMAX:420×530Alkaline, with US function
Single-wafer type washer67×105~530×920thickness to be put: 0.2t ~ 2.1t
Film formationFilm formationSpatter film forming machineMAX:210X300RF / DC power supply Reverse spattering possible
□MAX:270X270Corresponding TGT Cu, Ti, Cr, Ni, Au, Al, etc.
~385φFilm thickness approx. ± 10%
PhotolithographyCoating (resist)Roll coaterEffective width:100~550Resist thickness:1~2μm
Plate thickness:0.3~4
Spin coaterφ20~300×400Rotational speed:300~2500rpm ±1rpm
Bar coaterMAX:300×400 
Screen printingrange:300×500Camera alignment accuracy±0.1㎜
exposureExposure machineMAX300×400Alignment accuracy±1μm
developingSingle leaf type400×500Compatible with solvents and organic alkalis.
Batch tank300×400
etchingWet etchingSingle leaf type(ITO)420×530 0.2~2.8t
Shower type(Cu,Al,Cr)MAX:210X300*Cu,Al,Cr
Batch tank300×400* Please contact us for compatible membrane types.
Peel off (resist)Batch tankMAX370×470Alkaline type, organic solvent type
Drying / bakingOvenClean ovenInside:(W)800x(D)750x(H)1000Max350℃ Cleanliness class 100 N2 can be introduced
Hot plateHot plateMAX300×400Max300℃
DisconnectDisconnectScriberMax:500□ Max:3tCut accuracy±0.2mm
chamferChamfering machine20□~300×400Consultation is required for board thickness
TestMeasuring instrumentStereomicroscope  
Measuring microscope  
Transmittance measuring machine  
Digital force gauge  
Four probe tester  
Insulation tester  
othersevaluationConstant temperature bathInside:(W)400×(D)400×(H)400-85~180℃
High temperature and humidity tankInside:(W)500×(D)600×(H)750-40~100℃ 20~98%
Stirring / defoamingStirring / defoaming machineMax:250g 
UV irradiationSpot irradiator  
Single-leaf irradiatorEffective width:250 
RepairLaser repair machine  
FPC crimpingFPC crimping machineEffective width:30 
Effective width:100~300With alignment function
Pasting togetherFilm bonding machine Adhesion accuracy:±0.2㎜ 
Glass bonding machine200×300~360×400Alignment accuracy±0.1mm~
Pressurized defoamerInside:(W)400×(D)500×(H)600 

*Please contact us for details as all equipment depends on the material of the base material to be charged.

What is Photofabrication

Photofabrication is a type of manufacturing process that uses light to create minute structures and patterns.

It is mainly used in semiconductor manufacturing and microdevice manufacturing, and is important for efficiently and precisely manufacturing devices with fine structures.

The basic photo fabrication steps are as follows:

  • Photoresist coating: A thin light-sensitive film called a photoresist is applied to the target substrate to form a pattern of light that is developed.
  • Exposure: A light mask or optical system is used to project a specific pattern onto the photoresist.
  • Development: The photoresist is immersed in a developer and the areas changed by exposure are removed, leaving behind the desired pattern.
  • Etching or plating: Leaving areas protected by photoresist, areas removed by exposure may be etched or plated to form the final structure.
  • Photoresist removal: Remove the remaining photoresist to obtain the final product.

Photofabrication is essential in the production of microstructured devices and integrated circuits, and has wide applications in semiconductor engineering and microdevice manufacturing technology.

Photofabrication process explanation (patterning)

(Example: single-layer ITO)

Photofabrication process explanation

Forming a thin film resistor on the base material

  • Substrate materials include glass, Si wafer, film, and others.
  • Thin films can be laminated based on ITO, Cr, Al, etc. upon request.

(Consultation required)

Applying a material called resist that is exposed to UV light

  • Can be coated with developed materials and polyimide.
  • It is also possible to make different film thicknesses for each.
  • Can also coat non-photosensitive materials

After applying the resist, light baking is performed at a low temperature to dry the resist and make it adhere to the substrate.
However, it is dry enough to react with exposure and form a pattern.

Photofabrication process explanation

By applying UV light through a photomask (original plate), the resist changes in the areas exposed to UV light.
 Positive type: The area exposed to UV light will dissolve in the developer.
 Negative type: hardens where exposed to UV light

The developing solution (alkaline) dissolves the unnecessary parts of the resist,leaving only the parts where ITO is needed.

  • Use organic or inorganic alkali depending on the type of membrane.

It is a process that stabilizes and hardens photoresist.
Main baking allows the photoresist to firmly adhere to the substrate,improving its durability during subsequent processes such as etching and plating.

Photofabrication process explanation

The desired shape can be obtained by using an etching solution to dissolve, erode, and etch the parts of the film that are not protected by the resist.

Decompose the photoresist with an alkali or solvent and remove it. The stripping solution is selected depending on the type of thin film.

Visually inspect, reject non-conforming products, pack and ship.