Thin-film Patterning Processing
Features
1.Patterning processing corresponding to any thin film
In partnership with multiple film-formation manufacturers, we are capable of patterning processing various thin films.
Please consult with us each specification of the multilayer film.
2.Available for small lot / quick delivery
We are available for customer's desired quantity / delivery time.
Processing lead time:3 days.
3.Example of applications
4.Processing technology
- Sealing cap
- Rrooved pattern
- Hole forming
- Putting film to glass substrate
- Adhering glass substrates together
- Cell production etc.
5.Cutting and slight chamfering
- Scribing
- Dicing
- Resist
- Ag electrode
- Insulating film, etc.
9.Glass cutting
- plain glass
- with thin film ( multilayer film ) attached
10.Patterning by means of lift off
12.ITO Heater
- Visible heaters like ITO are recommended
5.Assisting various materials evaluation
- I would like you only to apply our own resist.
- Is there any place you can ask for exposure and development only?
- I would like to peel film from substrate!
- I want to work in a clean room.
- I want to get a small glass as cheap as possible !
- In addition to full course from normal cleaning / resist coating to packaging,Cleaning / resist coating only, exposure / development only, etching ~ cut chamfering etc.
We also accept processing limited to.
* Perform resist coating, exposure and development under a clean room. - In order to evaluate the development of base materials such as PET and PEN, we will assist you with conditions such as resist and polyimide coating.
- Also we will create an evaluation report according to your request.
- In addition to helping with evaluation of small lot, please consult mass production correspondence.
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Click here for the main equipment
6.Substrate for equipment evaluation
- Creating a performance evaluation board for optical equipment that requires pattern recognition
*For performance evaluation boards when considering the purchase of expensive equipment such as exposure machines - Creation of a glass substrate for evaluation of organic EL encapsulation equipment.
- Prototype supply of equipment evaluation boards even in small lots and in a wide variety of products
7.Target substrate / processing size
Target substrate
Maximum processing size
Key Track Records
Key patterning commissioned for mass production
| ITO pattern for STN-LCD | 50,000 panels per month |
|---|---|
| BM pattern for CF | 50,000 panels per month |
| ITO double-printed pattern for capacitance | 10,000 panels per month |
Patterning commissioned for development or prototyping
| For LCD |
3D pattern Pattern for electronic paper Pattern for evaluation of liquid crystal material |
|---|---|
| For organic EL |
Pattern for lighting or display Glass cap for sealing Pattern for evaluation of organic EL material |
| For various TEGs | Pattern for evaluation of ACF,IC,FPC, or LCD |
| For various MEMS | Pattern for evaluation of sensors |
| For various Heaters | Pattern for evaluation of ITO for heaters |
| Pattern for solar cell | The organic thin film solar cell electrode pattern |
| Thin film coating substrate film | Organic EL・Organic solar cell・Electrochromic pattern |
| Optical test chart | The distortion of lens, optical characteristic evaluation |
| Biotechnology | Micro channel・cell culture pattern |
| For Encorder | Rotary・Liner Encorder |
| Evaluation support for development of various materials | New resist · Pattern condition of film such as PET, PEN etc. Evaluation support |
| Microstructure formation | Follow ability evaluation of adhesive, adhesive film, filler (semiconductor PKG etc.) Micro folder such as micro LED Cover glass spacer of solar cell etc. |
Please make use of our equipment according to your request.
In particular, the photolithography process works in a clean room (Class1000) environment.
* Furthermore, the coating process (roll coater), exposure equipment, etc. are further improved in cleanliness at the local booth (Class100).
| Process | equipment | Corresponding board size (mm) | Specifications / Remarks | |
| Washing | washing machine | Batch type washer | MAX：420×530 | Alkaline, with US function |
| Single-wafer type washer | 67×105～530×920 | thickness to be put: 0.2t ~ 2.1t | ||
| Film formation | Film formation | Spatter film forming machine | MAX：210X300 | RF / DC power supply Reverse spattering possible |
| □MAX：270X270 | Corresponding TGT Cu, Ti, Cr, Ni, Au, Al, etc. | |||
| ～385φ | Film thickness approx. ± 10% | |||
| Photolithography | Coating (resist) | Roll coater | Effective width：100～550 | Resist thickness：1～2μm |
| Plate thickness：0.3～4 | ||||
| Spin coater | φ20～300×400 | Rotational speed：300～2500rpm ±1rpm | ||
| Bar coater | MAX：300×400 | |||
| Screen printing | range：300×500 | Camera alignment accuracy±0.1㎜ | ||
| range：600×800 | ||||
| exposure | Exposure machine | MAX300×400 | Alignment accuracy±1μm | |
| MAX400×500 | ||||
| developing | Single leaf type | 400×500 | Compatible with solvents and organic alkalis. | |
| Batch tank | 300×400 | |||
| etching | Wet etching | Single leaf type（ITO） | 420×530 0.2～2.8ｔ | |
| Shower type（Cu,Al,Cr） | MAX：210X300 | ＊Cu,Al,Cr | ||
| Batch tank | 300×400 | * Please contact us for compatible membrane types. | ||
| Peel off (resist) | Batch tank | MAX370×470 | Alkaline type, organic solvent type | |
| Drying / baking | Oven | Clean oven | Inside：（W)800ｘ（D)750ｘ（H)1000 | Max350℃ Cleanliness class 100 N2 can be introduced |
| Hot plate | Hot plate | MAX300×400 | Max300℃ | |
| Disconnect | Disconnect | Scriber | Max：500□ Max：3ｔ | Cut accuracy±0.2mm |
| chamfer | Chamfering machine | 20□～300×400 | Consultation is required for board thickness | |
| Test | Measuring instrument | Stereomicroscope | ||
| Measuring microscope | ||||
| Profilometer | ||||
| Transmittance measuring machine | ||||
| Digital force gauge | ||||
| Four probe tester | ||||
| Insulation tester | others | evaluation | Constant temperature bath | Inside：（W)400×（D)400×（H)400 | -85～180℃ |
| High temperature and humidity tank | Inside：（W)500×（D)600×（H)750 | -40～100℃ 20～98％ | ||
| Stirring / defoaming | Stirring / defoaming machine | Max：250ｇ | ||
| UV irradiation | Spot irradiator | |||
| Single-leaf irradiator | Effective width：250 | |||
| Repair | Laser repair machine | |||
| FPC crimping | FPC crimping machine | Effective width：30 | ||
| Effective width：100～300 | With alignment function | |||
| Pasting together | Film bonding machine | Adhesion accuracy：±0.2㎜ | ||
| Glass bonding machine | 200×300～360×400 | Alignment accuracy±0.1mm～ | ||
| Pressurized defoamer | Inside：（W)400×（D)500×（H)600 | |||
＊Please contact us for details as all equipment depends on the material of the base material to be charged.