Thin-film Patterning Processing

Please make use of our equipment according to your request.

In particular, the photolithography process works in a clean room (Class1000) environment.

* Furthermore, the coating process (roll coater), exposure equipment, etc. are further improved in cleanliness at the local booth (Class100).

Process		equipment	Corresponding board size (mm)	Specifications / Remarks
Washing	washing machine	Batch type washer	MAX：420×530	Alkaline, with US function
		Single-wafer type washer	67×105～530×920	thickness to be put: 0.2t ~ 2.1t
Film formation	Film formation	Spatter film forming machine	MAX：210X300	RF / DC power supply Reverse spattering possible
			□MAX：270X270	Corresponding TGT Cu, Ti, Cr, Ni, Au, Al, etc.
			～385φ	Film thickness approx. ± 10%
Photolithography	Coating (resist)	Roll coater	Effective width：100～550	Resist thickness：1～2μm
			Plate thickness：0.3～4
		Spin coater	φ20～300×400	Rotational speed：300～2500rpm　±1rpm
		Bar coater	MAX：300×400
		Screen printing	range：300×500	Camera alignment accuracy±0.1㎜
			range：600×800
	exposure	Exposure machine	MAX300×400	Alignment accuracy±1μm
			MAX400×500
	developing	Single leaf type	400×500	Compatible with solvents and organic alkalis.
		Batch tank	300×400
etching	Wet etching	Single leaf type（ITO）	420×530　0.2～2.8ｔ
		Shower type（Cu,Al,Cr）	MAX：210X300	＊Cu,Al,Cr
		Batch tank	300×400	* Please contact us for compatible membrane types.
	Peel off (resist)	Batch tank	MAX370×470	Alkaline type, organic solvent type
Drying / baking	Oven	Clean oven	Inside：（W)800ｘ（D)750ｘ（H)1000	Max350℃　Cleanliness class 100　N2 can be introduced
	Hot plate	Hot plate	MAX300×400	Max300℃
Disconnect	Disconnect	Scriber	Max：500□　Max：3ｔ	Cut accuracy±0.2mm
	chamfer	Chamfering machine	20□～300×400	Consultation is required for board thickness
Test	Measuring instrument	Stereomicroscope
		Measuring microscope
		Profilometer
		Transmittance measuring machine
		Digital force gauge
		Four probe tester
		Insulation tester
others	evaluation	Constant temperature bath	Inside：（W)400×（D)400×（H)400	-85～180℃
		High temperature and humidity tank	Inside：（W)500×（D)600×（H)750	-40～100℃　20～98％
	Stirring / defoaming	Stirring / defoaming machine	Max：250ｇ
	UV irradiation	Spot irradiator
		Single-leaf irradiator	Effective width：250
	Repair	Laser repair machine
	FPC crimping	FPC crimping machine	Effective width：30
			Effective width：100～300	With alignment function
	Pasting together	Film bonding machine		Adhesion accuracy：±0.2㎜
		Glass bonding machine	200×300～360×400	Alignment accuracy±0.1mm～
		Pressurized defoamer	Inside：（W)400×（D)500×（H)600

＊Please contact us for details as all equipment depends on the material of the base material to be charged.

What is Photofabrication

Photofabrication is a type of manufacturing process that uses light to create minute structures and patterns.

It is mainly used in semiconductor manufacturing and microdevice manufacturing, and is important for efficiently and precisely manufacturing devices with fine structures.

The basic photo fabrication steps are as follows:

• Photoresist coating: A thin light-sensitive film called a photoresist is applied to the target substrate to form a pattern of light that is developed.
• Exposure: A light mask or optical system is used to project a specific pattern onto the photoresist.
• Development: The photoresist is immersed in a developer and the areas changed by exposure are removed, leaving behind the desired pattern.
• Etching or plating: Leaving areas protected by photoresist, areas removed by exposure may be etched or plated to form the final structure.
• Photoresist removal: Remove the remaining photoresist to obtain the final product.

Photofabrication is essential in the production of microstructured devices and integrated circuits, and has wide applications in semiconductor engineering and microdevice manufacturing technology.

Photofabrication process explanation (patterning)

(Example: single-layer ITO)